Western Digital BiCS4 96-Layer 3D NAND Technology Announced
Technology and Operational Execution Remains Strong Western Digital Corp. (NASDAQ: WDC), a global data storage technology and solutions leader, today announced that it has successfully developed its next-generation 3D NAND technology, BiCS4, with 96 layers of vertical storage capability. Sampling to OEM customers is expected to commence in the second half of calendar year 2017 and initial production output is expected in calendar year 2018. BiCS4, which was developed jointly with Western Digital’s technology and manufacturing partner Toshiba Corporation, will be initially deployed in a 256-gigabit chip and will subsequently ship in a range of capacities, including a terabit on a single chip. “Our successful development of the industry’s first 96-layer 3D NAND technology demonstrates Western Digital’s continued leadership in […]
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