Samsung Portable SSD T5 Introduced

Built with V-NAND technology, drive features industry-leading transfer speeds with encrypted data security in a compact and durable design Samsung Electronics America, Inc. today announced the introduction of the Samsung Portable SSD T5 – the newest portable solid state drive (PSSD) that raises the bar for the performance of external memory products. The T5, built with Samsung’s latest 64-layer V-NAND technology, delivers industry-leading transfer speeds with encrypted data security in a compact and durable design, making it easier than ever for consumers to access their most valuable data anywhere, at any time. “Samsung has been pushing the envelope of what is possible in portable storage and solid state drives for years, and the Portable SSD T5 continues our legacy of […]

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Samsung V-NAND SSD 950 PRO M2 NVMe

Samsung 950 PRO SSD Debuts In NVMe M.2

Samsung Electronics Co., Ltd. today announced the introduction of the Samsung 950 PRO solid state drive (SSD), designed to meet the demands of high-performance consumer and business laptops and PCs. The drive’s M.2 form factor means that users with ultra-slim notebook PCs and workstations can benefit from industry-leading storage endurance, reliability and energy efficiency.

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Samsung Starts Mass Producing Industry’s First 3D Vertical NAND Flash

Samsung 3D Vertical NAND (V-NAND) Flash Memory Developed

By Samsung Electronics Co., Ltd. Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first three-dimensional 3D Vertical NAND (V-NAND) flash memory, which breaks through the current scaling limit for existing NAND flash technology. Achieving gains in performance and area ratio, the new 3D V-NAND will be used for a wide range of consumer electronics and enterprise applications, including embedded NAND storage and solid state drives (SSDs). Samsung’s new V-NAND offers a 128 gigabit (Gb) density in a single chip, utilizing the company’s proprietary vertical cell structure based on 3D Charge Trap Flash (CTF) technology and vertical interconnect process technology to link the 3D cell array. By applying […]

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