Toshiba QLC BiCS FLASH 3D Memory Introduced Achieves World’s Largest Capacity of 1.5TB in a Single Package Toshiba America Electronic Components, Inc. (TAEC)* today announced the latest generation of its BiCS FLASHTM three-dimensional (3D) flash memory1. The newest BiCS FLASH device features 4-bit-per-cell, quadruple-level cell (QLC) technology and is the first2 3D flash memory device …
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